IPC 7352-2023 PDF

IPC 7352 PDF

This document provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled.

Adjustments to the information in this guideline may be required to meet company and/or board technology requirements. It is recommended that a company should document the modifications to the IPC-7352 content in corporate command media documentation.

A land pattern is the representation of the area and features on a printed board needed for a component to be placed and attached to the printed board during an assembly process. The land pattern is usually built using ECAD Library tools.