IEC 61189-2-808 Ed. 1.0 b:2024 PDF
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Test Methods For Electrical Materials, Printed Board And Other Interconnection Structures And Assemblies – Part 2-808: Thermal Resistance Of An Assembly By Thermal Transient Method
International Electrotechnical Commission , 04/01/2024
IEC 61189-2-808 Ed. 1.0 b:2024 PDF
This part of IEC 61189 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.
NOTE This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.
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