BS PD IEC TR 63378-1:2021 PDF
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Thermal standardization on semiconductor packages-Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
BSI Group , 01/11/2022
File Format: PDF
BS PD IEC TR 63378-1:2021 PDF
This part of IEC 63378 specifies the terms and definitions that are commonly used for thermal characteristics of BGA and QFP type semiconductor packages, and guidelines to use these thermal characteristics.
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