BS PD IEC TR 61760-3-1:2022 PDF
$132.00
Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
BSI Group , 10/31/2022
File Format: PDF
BS PD IEC TR 61760-3-1:2022 PDF
Surface mounting technology-Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
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